Diagnostics Technical Committee

DEIS Diagnostics Technical Committee

Motivation & areas of interest  

Electrical insulation systems are key elements of low, medium and high voltage (HV) equipment determining the operational reliability. The modern constructions of high voltage electric insulating systems must meet high standards of electrical, thermal, mechanical and chemical endurance. Further, the trends towards stronger, smarter and greener grids enforce the need for adequate diagnostics and monitoring methodologies.

Fig. 1 Identified hot spot on HV insulator

Problems of operational diagnostics of electric power equipment like for example transformers, cables, HVDC systems, electrical machines, gas insulated substations, breakers or insulators have a special meaning nowadays in the exploitation management. Broader applications of power electronics on higher and higher voltage levels cause challenges for insulating systems and require development of proper diagnostic methods.

The assessment of the properties of an HV insulation system is an essential issue both after the production of electric power equipment, as well as during diagnostics and monitoring procedures. Many research and scientific efforts are devoted to the understanding of various physical mechanisms, and together with new instrumentation lead to the development of new diagnostics methods. Also development and application of new materials imposes a need for new measurement approaches and dedicated diagnostic methodologies. Diagnostic challenges result from the great progress in underling material science including nanomaterials, electronics, smart sensors, communication and software technologies. The key element in diagnostics is of course proper interpretation of acquired information referred to underlying physical phenomena in dielectric insulation systems.

The modern diagnostics strategies relay on complementary measurements performed both of-line or during on-line monitoring. Thus challenges refer to detection of diagnostic symptoms, proper interpretation and effective utilization of diagnostic information. 

Since condition monitoring and diagnostics related topics belong to focal activities in electrical insulation and gain enormous attention nowadays, one of the IEEE Dielectrics and Electrical Insulation Society (DEIS) Technical Committees (TC) is devoted to this subject.

Opportunities & goals  

The DEIS Diagnostics Technical Committee would like to create opportunities for people willing to work in the broadly understood field of diagnostics of electrical power equipment and systems. This applies to both academia and industry, experts and scientists as well as young adepts, students and early career engineers, and to enhance the connection between generational experiences and the search for new diagnostic methods based on multidisciplinary technologies. Hence, an important element of the current composition of the truly international Diagnostics TC team is the complementary experiences regarding both high-voltage devices, systems and technologies.

Fig. 2 New challenges for partial discharge based diagnostics create pulse-width modulated (PWM) stimuli

The Technical Committee on Diagnostics offers to DEIS Members the following:

  • Establishment and networking of a team of people involved in electrical insulation diagnostics related activities
  • Preparation and coordination of positioning publications in IEEE DEIS Transactions, and EIM – Electrical Insulation Magazine
  • Influencing technical standards,
  • enforcing collaboration between industrial research and the academic scientific community
  • Promoting awareness campaigns of diagnostics, through various channels, like university faculties, students, industry etc.
  • Broadcasting technical innovations, achievements, information and activities on the DEIS Website and through the EIM
  • Organizing workshop sessions
  • Introducing on-line webinars

Planned future activities

After three successful editions in 2013, 2016 and 2020 of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) special issues on “Condition Monitoring and Diagnostics of Electrical Insulation” [1-3], a new edition will be planned. All special TDEI issues were well received with a high number of submissions – most of committee members submitted papers and were also actively involved in the review process. The following topics are of main interest:

  • Condition monitoring and diagnostics of electrical power equipment
  • Diagnostics and monitoring of electrical insulation due to electrical, mechanical, chemical and thermal causes
  • Challenges in partial discharge based assessment of electrical insulation 
  • Impact of new materials on electrical insulation diagnostics 
  • Aging and degradation assessment of electrical power equipment
  • Advanced sensing for condition monitoring of electrical insulation
  • Emerging diagnostics methods 
  • High frequency methods in diagnostics of electrical insulation
  • Application of signal, image processing and artificial intelligence to diagnostics of electrical insulation
  • DC Diagnostics, i.e. methods for monitoring electrical insulation in HVDC grids,
    cables, transformers, converters, breakers, substations, lines, insulators, etc. 

In addition, it is planned to discuss a Position Paper to be submitted to IEEE Electrical Insulation magazine / IEEE Transactions “Trends in Diagnostics and Monitoring of High Voltage Insulation” (working title). A definition of subjects, key areas related to both technologies and HV equipment as well as a number of invited contributors will follow soon.

TC Members are having opportunity to provide technical seminars for IEEE DEIS members within the scope of their scientific and professional activities.

Another networking platform, especially for students and early career engineers, will offer planned workshops jointly organized with national DEIS Chapters.

The committee is also seeking cooperation with other working groups within IEEE, IEC, CIGRE and other organizations.

The Diagnostics Technical Committee is open for professionals and young scientists to join the Diagnostics community worldwide. The invitation is extended to those interested to join our forces and accelerate some coordinated DEIS activities related to DIAGNOSTICS and CONDITION MONITORING.

Committee Members and Affiliations

No.Member Name Member Affiliation
1Dr. Bidhan Biswas  Indian Institute of Science, Bangalore, India
2Pr. Boxue Du                                 
University of Tianjin, China
3Pr. Hans Edin
KTH – Royal Institute of Technology, Stockholm, Sweden
4Pr. Marek FlorkowskiChair, AGH University of Science and Technology, Kraków, Poland
5Pr. Francesco Guastavino
University of Genova, Italy
6Dr. Thomas Hammarstrom             
Chalmers University of Technology, Gothenburg, Sweden
7Pr. Masayuki Hikita    Kyushu Institute of Technology, Kitakyushu, Japan
8Dr. Martin Judd
HFDE High Frequency Diagnostics, Glasgow, UK
9Dr. Wojciech Kołtunowicz
Omicron Energy Solution, Austria
10Pr. Behzad Kordi
University of Manitoba, Canada
11Pr. Masahiro KozakoKyushu Institute of Technology, Kitakyushu, Japan
12Dr. Maciej Kuniewski
AGH University of Science and Technology, Kraków, Poland
13Pr. Jean Li                                          
University of Chongqing, China
14Pr. Guoming MaNorth China Electric Power University, China
15Dr. Cheng PanUniversity of Wuhan, China
16Dr. Chenyeop ParkCollege of Engineering & Applied Science, Milwaukee, USA
17Pr. Toan Phung University of New South Wales, Sydney,  Australia
18Dr. Arpan Kumar Pradhan
Jadavpur University, Kolkata, India
19 Pr. Simon RowlandUniversity of Manchester, UK
20Pr. Lakshminarayana Satish Indian Institute of Science, Bangalore, India
21Pr. Brian Stewart
University of Strathclyde, UK
22Dr. Greg Stone
Iris Power, Toronto, Canada
23Dr. Xiangdong XuChalmers University of Technology, Gothenburg, Sweden

For more information about the committee and future participation in the activities of the Technical Committee on Diagnostics, please contact the committee chair, Dr Marek Florkowski at [email protected].


[1] M.Florkowski, S.Gubański, IEEE Trans. Dielectr. Electr. Insul., Special issue on “Condition Monitoring and Diagnostics of Electrical Insulation”, Vol. 20, No.  6, 2013.

[2] M.Florkowski, S.Gubański, IEEE Trans. Dielectr. Electr. Insul., Special issue on “Condition Monitoring and Diagnostics of Electrical Insulation”, Vol. 23, No.  3, 2016.

[3] M.Florkowski, J.Li, IEEE Trans. Dielectr. Electr. Insul., Special issue on “Condition Monitoring and Diagnostics of Electrical Insulation”, Vol. 27, No.  6, 2020.