Scope of TDEI
IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) publishes articles on dielectric phenomena and measurements to analyze these phenomena; development and characterization of vacuum, gaseous, liquid, and solid dielectrics and electrical insulating components of systems; investigation of dielectric properties for innovative use including functional dielectrics; diagnostic and prognostic methods with a primary focus on the behavior and properties of the electrical insulation in devices under operational stresses. The description of diagnostic methods without a primary link to the dielectric phenomena studied does not belong in these Transactions.
IEEE Transactions on Dielectrics and Electrical Insulation table of contents, abstracts and transactions are found in the IEEE Xplore TDEI site.
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The Transactions on Dielectrics and Electrical Insulation publishes three categories of technical reports: papers, reviews, and dielectric letters.
Papers (up to 8 pages) are well-documented final reports of research projects. Dielectric Letters (up to 3 pages) are shorter and contain noteworthy items of technical interest or ideas requiring rapid publication.
Reviews are synoptic papers on a subject of general interest, with ample literature references, and written for readers with widely varying backgrounds.
All articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE Publication Services and Products Board Operations Manual. Each published article was reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance.
Submit your Transaction Paper via IEEE Author Portal
Follow closely the author guidelines [PDF] and use the MS Word or LaTex Template.
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Call for Papers
Special Issue on Condition Monitoring and Diagnostics of Electrical Insulation
A special issue of the IEEE Transactions on Dielectrics and Electrical Insulation (IEEE TDEI) is being planned on Condition Monitoring and Diagnostics of Electrical Insulation for publication in February 2025. Authors wishing to have their papers considered for publication in this issue should submit their manuscripts to the IEEE TDEI submission portal https://ieee.atyponrex.com/journal/tdei. Authors will be able to choose the name of the intended special issue during the first step of the submission process. Instructions for preparation of the manuscripts and a template are available at https://ieeedeis.org/publications/transactions-on-dielectrics-and-electrical-insulation/.
For this special issue suggested topics within the field of condition monitoring and diagnostics of electrical insulation include, but are not limited to:
- Condition monitoring and diagnostics of electrical power equipment
- Diagnostics and monitoring of electrical insulation due to electrical
mechanical, chemical and thermal causes
- Challenges in partial discharge based assessment of electrical insulation
- Impact of new materials on electrical insulation diagnostics
- Aging and degradation assessment of electrical power equipment
- Advanced sensing for condition monitoring of electrical insulation
- Emerging diagnostics methods
- High frequency methods in diagnostics of electrical insulation
- Application of signal, image processing and artificial intelligence to diagnostics of electrical insulation
- DC Diagnostics, i.e. methods for monitoring electrical insulation in HVDC grids, cables, transformers, converters, breakers, substations, lines, insulators, etc.
- Condition monitoring and diagnostics of electrical insulation in new type of electrical equipment, i.e. electric vehicle, high-speed train, all-electric ship, more-electric aircraft, offshore wind power equipment
In accordance with IEEE policy, papers that have been published in any conference proceedings cannot be republished. The CrossCheck plagiarism software will be used to verify originality.
The deadline for submission of the manuscript is June 30, 2024.
The guest editors for this issue are:
Prof. Marek Florkowski (AGH University of Krakow, Department of Electrical and Power Engineering, Al. Mickiewicza 30, 30-059 Krakow, Poland; Email: [email protected])
Dr. Cheng Pan (Wuhan University, School of Electrical Engineering and Automation, Bayi Road No. 299, Wuchang District, Wuhan 430072, China; Email: [email protected])
Further questions concerning this Special Issue can be directed to either one of the two Guest Editors or directly to the Editor-in-Chief of the IEEE Transaction on Dielectrics and Electrical Insulation Professor Michael Wübbenhorst ([email protected])
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Call for Papers
Special Issue on Electrets and Related Phenomena
A special issue of the IEEE Transactions on Dielectrics and Electrical Insulation (IEEE TDEI) is being planned on Electrets and Related Phenomena for publication in June 2024. This issue is open to all authors. Presenters of papers at the IEEE 19th International Symposium on Electrets (ISE19) to be held during September 18-22, 2023 in Linz (Austria) are especially encouraged to submit their work to this special issue.
Authors should submit their manuscripts to the IEEE TDEI submission portal https://ieee.atyponrex.com/journal/tdei. During the first step of the submission process, authors will be able to choose the name of the intended special issue during the first step of the submission process. Instructions for preparation of manuscripts and templates for MSWord and LaTeX are available at https://ieeedeis.org/publications/transactions-on-dielectrics-and-electrical-insulation/.
For this special issue suggested topics within the field of dielectric spectroscopy include, but are not limited to:
- Charge related phenomena in dielectrics (charge injection, transport & trapping)
- Thermally stimulated current & dielectric relaxation
- Nanoscale measurements of electrostatic phenomena
- Ferroelectric, piezoelectric & pyroelectric phenomena
- Ferroelectrets & photoelectrets
- Electrostatic & dielectric phenomena in life science: bioelectrets
- Non-linear electrical & optical effects
- Applications of thin-film ferroelectric materials
- Electrets in organic electronics
- Soft actuators & sensors
- Functional materials and dielectrics
In accordance with IEEE policy, papers that have been published in any conference proceedings cannot be republished. A plagiarism tool will be used to verify originality. Submissions will undergo full peer review by at least two reviewers. Accepted papers will be available online within 10 days as Early view papers in IEEE Xplore.
The deadline for the submission of the manuscripts is November 30, 2023. Further questions concerning this Special Issue could be directed to either one of the three Guest Editors or directly to the Editor-in-Chief of the IEEE Transaction on Dielectrics and Electrical Insulation, Professor Michael Wübbenhorst (wubbenh[email protected]). The Guest Editors for this special issue are:
| Martin Kaltenbrunner
Soft Matter Physics Johannes Kepler University Linz, Austria |
Dmitry Rychkov
Deggendorf Institute of Technology, Weißenburg, Germany |
Reinhard Schwödiauer
Soft Matter Physics Johannes Kepler University Linz, Austria |