Co-sponsored conferences

ICEMPE is a Conference on applications of electrical insulation and dielectric materials to be held every two years in China. DEIS is a co-sponsor 30% of this conference together with China Electrotechnical Socitey. Some topics of interest will include: Dielectric Physics related to Conduction, polarization and breakdown (Trees); Space charge, Molecular simulation and calculation; Insulating Materials related to: performance, composition and structure, Nanocomposite, Eco-friendly dielectrics, Biodielectrics; Power Equipment related: fabrication, detection, operation and assessment, Cable, Motor, Transformer, GIS, HVDC Insulating materials and phenomena related to Superconductivity, Arcing, Gas Discharge, Surface Discharge, Structural Optimization of Electrical Insulation; Electrical Insulation Techniques under extreme conditions, High temperature, Electrical insulation in space.

  • 2025 – TDB

IWIPP is a biennial IEEE event dedicated to advancing the state-of-the-art in power semiconductor packaging, which is widely recognized as one of the critical factors influencing the performance and reliability of today’s power electronics. The conference is financially sponsored by the IEEE Power Electronics Society, IEEE Dielectrics and Electrical Insulation Society, Power Sources Manufacturers Association, and the IEEE Electronics Packaging Society.

  • April 8-10, 2025 – The University of Alabama, Tuscaloosa, AL (USA) – Event Details