IWIPP is a biennial IEEE event dedicated to advancing the state-of-the-art in power semiconductor packaging, which is widely recognized as one of the critical factors influencing the performance and reliability of today’s power electronics. The conference is financially sponsored by the IEEE Power Electronics Society, IEEE Dielectrics and Electrical Insulation Society, Power Sources Manufacturers Association, and the IEEE Electronics Packaging Society.
Next conference will be in:
April 8-10, 2025 – The University of Alabama, Tuscaloosa, AL (USA) – website
