Upcoming IEEE DEIS Conferences and Meetings

Following are upcoming IEEE DEIS conferences with links to the specific conference sites and local meeting notices. Fully sponsored IEEE DEIS conferences will be noted with the DEIS logo on the conference website in which a DEIS member discount will apply.

Note: Fully sponsored conferences are marked with an (FS);  technically sponsored conferences are denoted as (TC).

The COVID-19 pandemic has made it very difficult to provide you with an accurate conference schedule. Instead of holding face-to-face meetings at their scheduled time, some conferences have decided to either hold a virtual conference or delay/cancel their meeting. Please check the conference website to receive the most up-to-date information.

Upcoming 2022 DEIS Conferences:

International Workshop on Integrated Power Packaging (IWIPP): August 24-26, 2022 — Grenoble, France (FS)

International Conference on High Voltage Engineering and Applications (ICHVE): September 25-29, 2022 — Chongqing University, China, Virtual/Hybrid Event (FS)

Conference on Electrical Insulation and Dielectric Phenomena (CEIDP): October 30-November 2, 2022 — Denver, CO, US (FS)

International Conference on Condition Monitoring and Diagnosis (CMD): November 13-18, 2022 — Kitakyushu, Japan (TC)

Please refer to conference websites direction for additional information on submission deadlines, hotel information, and points of contact. Conference summaries can be found on the conferences page. A calendar of all upcoming conferences can be found on the events page.