Upcoming IEEE DEIS Conferences and Meetings

Following are upcoming IEEE DEIS conferences with links to the specific conference sites and local meeting notices. Fully sponsored IEEE DEIS conferences will be noted with the DEIS logo on the conference website in which a DEIS member discount will apply.

Note: Fully sponsored conferences are marked with an (FS);  technically sponsored conferences are denoted as (TC).

Upcoming 2021 DEIS Conferences:

International Conference on Electrical Materials and Power Equipment (ICEMPE): April 11-15, 2021 – Chongqing, China – HYBRID EVENT (both on-site and virtual) (FS)

Electrical Insulation Conference (EIC): June 7-28, 2021 – VIRTUAL EVENT (FS)

International Conference on the Properties and Applications of Dielectric Material (ICPADM): July 11-15, 2021 –  VIRTUAL EVENT (FS)

International Symposium on Electrets (ISE): September 24-28, 2021 – VIRTUAL EVENT (FS)

International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV): September 26-October 1, 2021 –  Padova, Italy (TC)

Conference on Electrical Insulation and Dielectric Phenomena (CEIDP): October 17-21, 2021 – Vancouver, Canada (FS)

Please refer to conference websites direction for additional information on submission deadlines, hotel information, and points of contact. Conference summaries can be found on the conferences page. A calendar of all upcoming conferences can be found on the events page.