Upcoming IEEE DEIS Conferences and Meetings
Following are upcoming IEEE DEIS conferences with links to specific conference sites and local meeting notices. Fully sponsored IEEE DEIS conferences will be noted with the DEIS logo on the conference website in which a DEIS member discount will apply.
Note: Fully sponsored conferences are marked with an (FS); technically sponsored conferences are denoted as (TC).
The COVID-19 pandemic has made it very difficult to provide you with an accurate conference schedule. Instead of holding face-to-face meetings at their scheduled time, some conferences have decided to either hold a virtual conference or delay/cancel their meeting. Please check the conference website to receive the most up-to-date information.
Upcoming 2023 DEIS Conferences:
International Electrical Insulation Conference (INSUCON): April 18-20, 2023 — Birmingham, UK (TS)
International Conference on Electrical Materials and Power Equipment (ICEMPE): May 7-10, 2023 — Shanghai, China | Hybrid Event (FS)
Electrical Insulation Conference (EIC): June 18-21, 2023— Quebec City, Canada (FS)
International Conference on Dielectric Liquids (ICDL): June 25-28, 2023 — Worcester, MA, USA (FS)
30th International Symposium on Discharge and Electrical Insulation in Vacuum (ISDEIV): June 25-30, 2023 — Okinawa, Japan (TS)
International Symposium on Electrets (ISE): September 18-23, 2023 — Linz, Austria (FS)
Conference on Electrical Insulation and Dielectric Phenomena (CEIDP): October 15-19, 2023 — East Rutherford, NJ, USA (FS)
Please refer to the conference websites’ directions for additional information on submission deadlines, hotel information, and points of contact. Conference summaries can be found on the conferences page. A calendar of all upcoming conferences can be found on the events page.