Upcoming IEEE DEIS Conferences and Meetings

Following are upcoming IEEE DEIS conferences with links to the specific conference sites and local meeting notices. Fully sponsored IEEE DEIS conferences will be noted with the DEIS logo on the conference website in which a DEIS member discount will apply.

Note: Fully sponsored conferences are marked with an (FS);  technically sponsored conferences are denoted as (TC).

Upcoming 2020 DEIS Conferences:

Conference on Electrical Insulation and Dielectric Phenomena: October 18-30, 2020 – VIRTUAL EVENT (FS)

Condition Monitoring and Diagnosis (CMD): October 25-28, 2020 – VIRTUAL EVENT (TC)

Upcoming 2021 DEIS Conferences:

International Conference on Electrical Materials and Power Equipment (ICEMPE): April 4-8, 2021 – Chongqing, China (FS)

International Workshop on Integrated Power Packing (IWIPP): April 28-30, 2021 – Aalborg, Denmark (FS)

Electrical Insulation Conference (EIC): June 7-21, 2021 – VIRTUAL EVENT (FS)

International Conference on Dielectric Liquids (ICDL): June 27-July 1, 2021 – Seville, Spain (FS)

International Conference on the Properties and Applications of Dielectric Material (ICPADM): July 11-15, 2021 –  Johor Bahru, Malaysia (FS)

International Symposium on Electrets (ISE): September 24-28 – Shanghai, China (FS)

International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV): September 26-October 1, 2021 –  Padova, Italy (TC)

Conference on Electrical Insulation and Dielectric Phenomena (CEIDP): October 17-21, 2021 – Vancouver, Canada (FS)

Please refer to conference websites direction for additional information on submission deadlines, hotel information, and points of contact. Conference summaries can be found on the conferences page. A calendar of all upcoming conferences can be found on the events page.