Latest News from DEIS

Call for Papers – ICPADM 2021

Invitation to submit papers to 2021 IEEE International Conference on the Properties and Applications of Dielectric Materials (ICPADM 2021), 12-14 July 2021 2021 IEEE International Conference on the Properties and Applications of Dielectric…

2021 AdCom Call for Nominations

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IEEE Dielectrics and Electrical Insulation Society (DEIS) 2021 CALL FOR NOMINATIONSDEIS ADMINISTRATIVE COMMITTEE (AdCom)AdCom manages the affairs of the IEEE Dielectrics and Electrical Insulation Society (DEIS). It is made up of 18 members-at-large,…

2020 DEIS Graduate Fellowship Winners

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Every year, the IEEE Dielectrics and Electrical Insulation Society offers fellowships to eligible graduate students who are pursuing areas of work of interest to the society. To learn more about the fellowship or apply for a future one,…

In Memory of Bruce Bernstein

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Bruce Bernstein, long time DEIS and PES member, passed away unexpectedly on Nov. 29, 2020 at the age of 89. Bruce was born in Brooklyn, N.Y., and was educated at City University of New York and Iowa State University, where he obtained his…

Call for Working Group Participants

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Call for Participation The Outdoor Insulation Technical Committee of IEEE DEIS is pleased to announce that two new working groups (WG) on two new projects described below are going to be formed. Those who are interested in joining any of…

December 2020 TDEI Issue

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Every other month, The Transactions on Dielectrics and Electrical Insulation publishes four categories of technical reports: papers; reviews; communications; and, dielectric letters and discussions. Topics are concerned with dielectric…

Position of Editor-in-Chief of the DEIS Electrical Insulation Magazine

DEIS is seeking suitable applicants for the position of Editor-in-Chief (EiC) of the Electrical Insulation Magazine (EIM). Potential applicants should be members of DEIS and have general knowledge of matters related to DEIS fields of interest.…