Introduction September 9 to 13, 2018, the fourth annual DEIS-sponsored Summer School on Dielectric Interfaces was held in Bertinoro, Italy. The objectives of the summer school are to organize brainstorms…
Every other month, The Transactions on Dielectrics and Electrical Insulation publishes four categories of technical reports: papers; reviews; communications; and, dielectric letters and discussions. Topics are concerned with dielectric phenomena and measurements, with development…
James West, DEIS long-standing member and Life Fellow, has been featured in the IEEE Spectrum blog for his work on a smart stethoscope. Read the post here and also his…
Every other month, The Transactions on Dielectrics and Electrical Insulation publishes four categories of technical reports: papers; reviews; communications; and, dielectric letters and discussions. Topics are concerned with dielectric phenomena and measurements, with development…
In memoriam Siegfried Bauer (Karlsruhe, Germany 15 May 1961 – 30 December 2018 Linz, Austria) Siegfried Bauer, an internationally renowned, very creative applied physicist, who also was a prolific materials…
Special Issue of the IEEE Transactions on Dielectrics and Electrical Insulation on Nanodielectrics Submission Deadline – 30 September 2019 Publication Date – April 2020 We are pleased to announce that the April 2020 issue of the IEEE…
The 7th International Condition Monitoring and Diagnosis (CMD 2018) conference was held in Perth, Western Australia, September 23 to 26, 2018. The CMD conference was established with the aim of…
The 2018 IEEE International Conference on High Voltage Engineering and Application (ICHVE 2018) was organized by the National Technical University of Athens–Greece and endorsed by the IEEE Dielectrics and Electrical…
It was my great pleasure to welcome colleagues and experts from all over the world to the 2018 Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) that was held in…
