Special Issue of the IEEE Transactions on Dielectrics and Electrical Insulation on Nanodielectrics

Submission Deadline – 30 September 2019

Publication Date – April 2020

We are pleased to announce that the April 2020 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a Special Issue on Nanodielectrics. This issue is open to all authors. Topics include, but are not restricted to:

A: Fabrication and characterization of Nanodielectrics

  1. New fabrication methods of nanodielectrics
  2. New characterization methods of nanodielectrics
  3. Surface modification techniques of nanoparticles
  4. Large scale preparation of nanodielectrics

B: Property and Property Enhancement Mechanism of Nanodielectrics

  1. Electrical properties of nanodielectrics under high electrical field
  2. Long time performance of nanodielectrics
  3. Unusual properties of nanodielectrics and the underlying mechanisms

C: Modeling and Simulation

  1. Computer-aided design of nanodielectrics
  2. Structure-property relationship of nanodielectrics

D: Applications

  1. Applications of nanodielectrics in power equipment and systems
  2. Applications of nanodielectrics in extreme environment
  3. Applications of nanodielectrics in electronic devices
  4. New applications of nanodielectrics

All papers will undergo the standard peer-review process for all IEEE Transactions and Journals.  The papers will be initially evaluated based on their scientific merit, novelty and presentation. Manuscripts that fail to fulfill these requirements will be rejected without peer review.  Papers will be automatically checked using CrossCheck for plagiarism including self-plagiarism.

Authors are invited to submit their papers to the TDEI website (http://www.cloznet.com/ieeetdei).  To ensure rapid processing, be sure to follow very closely the template and the instructions therein which can be downloaded here. On the Submissions Page, be sure to select from the dropdown list the “Guest Editor” for the Nanodielectrics Special Issue.  Note that the deadline for submissions is 30 September 2019.   

Questions concerning this Special Issue may be directed to the Guest Editors, Xingyi Huang at xyhuang@sjtu.edu.cn, Thomas Andritsch at t.andritsch@soton.ac.uk or to the Editor-in-Chief of the IEEE Transactions on Dielectrics and Electrical Insulation, Edward Cherney at each@sympatico.ca.

Guest Editors:

Prof. Xingyi Huang
Department of Electrical Engineering,Shanghai Key Lab of Electrical Insulation and Thermal Ageing,
Shanghai Jiao Tong University,
800 Dongchuan Road, Shanghai 200240, China
E-mail: xyhuang@sjtu.edu.cn

Dr. Thomas Andritsch
Electronics and Computer Science
University of Southampton
University Road, Southampton, SO17 1BJ, United Kingdom
Telephone: +442380599613
Email: T.Andritsch@soton.ac.uk