The 2019 Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) will take place October 20-23 in Richland, Washington, USA.
The goal of this annual Conference is to bring together researchers in all disciplines from industry, universities, government, and other laboratories to discuss the latest results and developments in the area of electrical insulation and dielectric phenomena. Original contributions are welcomed in theoretical and experimental aspects of dielectric, electronic, and electrostatic research on vacuum and gaseous media and on liquid and solid materials of organic and inorganic origins. The CEIDP is aimed at fostering free discussion of scientific and technical topics but conference participants are expected to avoid any commercialization of their research activities or research results. Membership in IEEE, DEIS, or other organizations is not required to participate in the Conference. However, it is strongly encouraged that CEIDP Board and Executive Committee are chosen from among the DEIS members.
This conference is fully sponsored by the IEEE Dielectrics and Electrical Insulation Society. Additional conference information will is available here.