CALL FOR PAPERS

Special Issue of the

IEEE Transactions on Dielectrics and Electrical Insulation

on

Condition Monitoring and Diagnostics of Electrical Insulation

 

We are pleased to announce that the June 2016 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a special issue on Condition Monitoring and Diagnostics topics.

The following non-exclusive list of topics may serve as a guideline for prospective authors:

  • Condition monitoring and diagnostics of electrical power equipment
  • Diagnostics and monitoring of electrical insulation
  • Challenges in partial discharge electrical insulation based assessment
  • Impact of new materials on electrical insulation diagnostics
  • Emerging diagnostics methods
  • High frequency methods in diagnostics of electrical insulation
  • Application of signal and image processing to diagnostics of electrical insulation
  • Asset management in diagnostics of electrical insulating systems

 

In addition, special interest is to be focused on topics related to DC Diagnostics, i.e. methods for monitoring HVDC grids, cables, transformers, converters, breakers, substations, lines, insulators, etc. Authors are invited to submit their papers to the Guest Editors of the Special Issue no later than 31 July 2015, at the TDEI website (http://www.cloznet.com/ieeetdei).

All submitted papers will automatically be checked using CrossCheck software for plagiarism including self-plagiarism.

Papers submitted after this date will be considered but may not meet the printing deadline and, if accepted, will be included in subsequent regular issues.

Please make sure to follow very closely the template which could be found on the Submission page of TDEI or directly from  http://www.cloznet.com/ieeetdei/TDEI%20Template.doc. The template is also provided at the website. Submissions should be marked during the submission process as special issue contributions by selecting the “Guest Editor” link and choosing the guest editor for this issue.

Questions regarding the Special Issue on Condition Monitoring and Diagnostics can be addressed to the Guest Editors or to the Editor-in-Chief of the IEEE Transactions on Dielectrics and Electrical Insulation, Professor Reuben Hackam at hackam@uwindsor.ca.

The Guest Editors for this issue are:

Marek Florkowski

ABB Corporate Research,

31-038 Kraków, Poland

Tel: +48-12 42 44 100, marek.florkowski@pl.abb.com 

 

Stanislaw Gubanski  Chalmers University of Technology,

Department of Materials and Manufacturing Technology

Hörsalsv 11, 412 96 Gothenburg, Sweden

Tel: +46 31 772 1616, stanislaw.gubanski@chalmers.se