A special issue of the IEEE Transactions on Dielectrics and Electrical Insulation (IEEE TDEI) is being planned on Broadband Dielectric Spectroscopy and its Applications for publication in June 2027. This issue is open to all authors. Presenters of papers at the 13th Conference on Broadband Dielectric Spectroscopy and its Applications (IDS2026) to be held during September 7 – 11, 2026 in Leuven (Belgium) are especially encouraged to submit their work to this special issue. Authors should submit their manuscripts to the IEEE TDEI submission portal. During the first step of the submission process, authors will be able to choose the name of the intended special issue during the first step of the submission process. Instructions for preparation of manuscripts and templates for MSWord and LaTeX are available. For this special issue suggested topics within the field of dielectric spectroscopy include, but are not limited to :
- Polymer Dynamics
- Soft Matter Dynamics and Phase Transitions in Amorphous, Partially Ordered and Ordered Systems
- Glassy Dynamics and its Scaling under Different Variables (e.g. Pressure, Temperature, Electric
Fields) - Water and Hydrogen Bonded Systems, Application of BDS to Life Science
- Terahertz Spectroscopy and Boson peak
- Charge Transport and Interfacial Effects
- Monitoring of kinetics by BDS: Chemical Reactions, Crystallization and Physical Ageing
- Ferroelectrics and non-linear effects
- Multi-diagnostics involving BDS, NMR, Thermal Analysis, Rheology or Scattering Techniques
- Confinement Effects, nanoporous materials
- Capacitance and Impedance based sensors
- Modeling, Theory, Simulations and Machine Learning
- Industrial and Technological Applications
In accordance with IEEE policy, papers that have been published in any conference proceedings cannot be republished. A plagiarism tool will be used to verify originality. Submissions will undergo full peer review by at least two reviewers. Accepted papers will be available online within 10 days as Early view papers in IEEE Xplore.
The deadline for the submission of the manuscripts is December 31, 2026.Further questions concerning this Special Issue could be directed to either one of the three Guest Editors or directly to the Editor-in-Chief of the IEEE Transaction on Dielectrics and Electrical Insulation, Professor Michael Wübbenhorst
([email protected])