Dear colleagues,

The Organizing Committee of the 2013 IEEE CEIDP (Conference on Electrical Insulation and Dielectric Phenomena) is pleased to inform you that the abstract submission site is now open.

The abstract submission deadline is February 15, 2013.

2013 IEEE CEIDP will be held in Shenzhen, P.R. China, on October 20-23, 2013.

Shenzhen is only a 30 min. ferry ride from the Hong Kong International Airport.

Please visit the conference web site at for more information.

The First Call for Papers can be downloaded at

Looking forward to seeing you all in Shenzhen, P.R. China.

Best regards,

Mahmoud Abou-Dakka
2013 IEEE CEIDP Conference Chair