CALL FOR PAPERS

Special Issue of the

IEEE Transactions on Dielectrics and Electrical Insulation

on

Vacuum Insulation, Fundamentals and Applications

Submission Deadline–30 November 2016

Publication Date December 2017

 We are pleased to announce that the December 2017 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a special issue on Vacuum Insulation, Fundamentals and Applications. This issue is open to all authors including presenters of papers at the 27th International Symposium on “Discharges and Electrical Insulation in Vacuum (ISDEIV 2016) to be held on 18–23 September, 2016 in Suzhou, China who are especially encouraged to submit their work to this special issue. Topics include, but are not restricted to:

A: Breakdown and Flashover

  1. 1. Vacuum breakdown and pre-breakdown phenomena
  2. Surface discharges and flashover phenomena

B: Vacuum arcs

  1. 1. Switching in vacuum and related phenomena
  2. Interaction of vacuum arc with magnetic field
  3. Vacuum arc physics
  4. Computer modeling and computer aided design
  5. Pulse power physics and technology

C: Applications

  1. 1. Vacuum interrupters and their applications
  2. Surface modification and other plasma applications
  3. Electron, ion, neutron, X-ray and other beam and light sources
  4. Accelerators and fusion reactor related issues
  5. Space related technologies

In accordance with IEEE policy, papers that have been published in any conference proceedings cannot be republished. Therefore, authors of the ISDEIV 2016 proceedings are strongly advised to significantly expand and enhance their conference paper versions prior to submission to this Special Issue of the IEEE TDEI.All submitted papers will automatically be checked using CrossCheck software for plagiarism including self-plagiarism. Authors are invited to submit their papers at the TDEI website to the Guest Editor of the Special Issue at the TDEI website (http://www.cloznet.com/ieeetdei). Please make sure to follow very closely the template which could be found onthe Submission page of TDEI or directly from

http://www.cloznet.com/ieeetdei/TDEI%20Template.doc.

 

The deadline for submission of papers is 30 November 2016. All papers will undergo a standard peer-review process typical for all IEEE Transactions and Journals. Submissions should be marked during the submission process as special issue contributions by selecting the “Guest Editor” link and choosing the guest editor for this issue.

Questions concerning this Special Issue may be directed to the Guest Editor, Professor Shenli Jia, or to the Editor-in-Chief of the IEEE Transactions on Dielectrics and Electrical Insulation, Professor Reuben Hackam at hackam@uwindsor.ca.

Prof. Shenli Jia

Dept. Electrical Engineering,

Xi’an Jiaotong University,

West 28 Xianning Rd., Xi’an, 710049 China.

Phone: +86-29-82668505, Fax: +86-29-82668581

E-mail: sljia@mail.xjtu.edu.cn