Special Issue of the IEEE Transactions on Dielectrics and Electrical Insulation on Vacuum Insulation, Fundamentals and Applications

Submission Deadline – 31 May 2019

Publication Date December 2019

We are pleased to announce that the December 2019 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a special issue on Vacuum Insulation, Fundamentals and Applications. This issue is open to all authors including presenters of papers at the 28th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV 2018) to be held on 24–28 September, 2018 in Greifswald, Germany who are especially encouraged to submit their work to this special issue. Topics include, but are not restricted to:

A: Breakdown and Flashover

  1. Vacuum breakdown and pre-breakdown phenomena
  2. Surface discharges and flashover phenomena

B: Vacuum arcs

  1. Switching in vacuum and related phenomena
  2. Interaction of vacuum arc with magnetic field
  3. Vacuum arc physics
  4. Computer modeling and computer-aided design
  5. Pulse power physics and technology

C: Applications

  1. Vacuum interrupters and their applications
  2. Surface modification and related technologies
  3. Electron, ion, neutron, X-ray and other beam and light sources
  4. Accelerators and fusion reactor-related issues
  5. Space-related technologies

In accordance with IEEE policy, papers that have been published in any conference proceedings cannot be republished. Therefore, authors of the ISDEIV 2018 proceedings are strongly advised to significantly expand and enhance their conference paper versions prior to submission to this Special Issue of the IEEE TDEI. All submitted papers will automatically be checked using CrossCheck software for plagiarism including self-plagiarism. Authors are invited to submit their papers at the TDEI website to the Guest Editor of the Special Issue at the TDEI website (http://www.cloznet.com/ieeetdei). Please make sure to follow very closely the template which could be found on the Submission page of TDEI or directly from http://www.cloznet.com/ieeetdei/TDEI%20Template.doc.

The deadline for submission of papers is 31 May 2019. All papers will undergo a standard peer-review process typical for all IEEE Transactions and Journals. Submissions should be marked during the submission process as special issue contributions by selecting the “Guest Editor” link and choosing the guest editor for this issue.

Questions concerning this Special Issue may be directed to the Guest Editor, Michael Kurrat at m.kurrat@tu-bs.de, or to the Editor-in-Chief of the IEEE Transactions on Dielectrics and Electrical Insulation, Edward Cherney at each@sympatico.ca.

Prof. Michael Kurrat
TU Braunschweig (Institute of Technology)
Dept. of Electrical Engineering, Information Technology, Physics
Schleinitzstr. 23, 38106 Braunschweig, Germany
Phone: +49-531-391-7735, Fax: +49-531-391-8106
E-Mail: m.kurrat@tu-bs.de