Entries by DEIS

, ,

February 2019 TDEI Issue

Every other month, The Transactions on Dielectrics and Electrical Insulation publishes four categories of technical reports: papers; reviews; communications; and, dielectric letters and discussions. Topics are concerned with dielectric phenomena and measurements, with development and characterization of gaseous, vacuum, liquid and solid electrical insulating materials and systems; and with utilization of these materials in circuits and systems under condition […]

,

In Memory of Siegfried Bauer

In memoriam Siegfried Bauer (Karlsruhe, Germany 15 May 1961 – 30 December 2018 Linz, Austria) Siegfried Bauer, an internationally renowned, very creative applied physicist, who also was a prolific materials scientist and engineer, died on 30 December 2018 in Linz, Austria, after a one-year battle with cancer. He was full professor of soft-matter physics at […]

, ,

TDEI Call For Papers – Nanodielectrics

Special Issue of the IEEE Transactions on Dielectrics and Electrical Insulation on Nanodielectrics Submission Deadline – 30 September 2019 Publication Date – April 2020 We are pleased to announce that the April 2020 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a Special Issue on Nanodielectrics. This issue is open to all authors. Topics include, but are […]

,

CMD 2018 Report

The 7th International Condition Monitoring and Diagnosis (CMD 2018) conference was held in Perth, Western Australia, September 23 to 26, 2018. The CMD conference was established with the aim of providing a platform for academia, industry, technology providers, consultants, and experts in power engineering to discuss and share ideas, present results, reflect on past experiences, […]

,

ICHVE 2018 Report

The 2018 IEEE International Conference on High Voltage Engineering and Application (ICHVE 2018) was organized by the National Technical University of Athens–Greece and endorsed by the IEEE Dielectrics and Electrical Insulation Society. The conference, chaired by Ioannis Gonos and co- chaired by Ioannis Stathopulos, Jian Li, and Nicolas Younan, was held in Athens, Greece, September […]

,

CEIDP 2018 Report

It was my great pleasure to welcome colleagues and experts from all over the world to the 2018 Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) that was held in Cancun, Mexico, from October 21 to 24, 2018. The CEIDP was established within the Division of Engineering and Industrial Research of the National Academy of […]

, ,

TDEI Call for Papers – Vacuum Insulation

Special Issue of the IEEE Transactions on Dielectrics and Electrical Insulation on Vacuum Insulation, Fundamentals and Applications Submission Deadline – 31 May 2019 Publication Date – December 2019 We are pleased to announce that the December 2019 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a special issue on Vacuum Insulation, Fundamentals and Applications. This issue is open to […]

, ,

December 2018 TDEI Issue

Every other month, The Transactions on Dielectrics and Electrical Insulation publishes four categories of technical reports: papers; reviews; communications; and, dielectric letters and discussions. Topics are concerned with dielectric phenomena and measurements, with development and characterization of gaseous, vacuum, liquid and solid electrical insulating materials and systems; and with utilization of these materials in circuits and systems under condition […]