Call for Papers – Special Issue on Electrets and Related Phenomena

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Special Issue on Electrets and Related Phenomena

A special issue of the IEEE Transactions on Dielectrics and Electrical Insulation (IEEE TDEI) is being planned on Electrets and Related Phenomena for publication in June 2024. This issue is open to all authors. Presenters of papers at the IEEE 19th International Symposium on Electrets (ISE19) to be held during September 18-22, 2023 in Linz (Austria) are especially encouraged to submit their work to this special issue.

Authors should submit their manuscripts to the IEEE TDEI submission portal https://ieee.atyponrex.com/journal/tdei. During the first step of the submission process, authors will be able to choose the name of the intended special issue during the first step of the submission process. Instructions for preparation of manuscripts and templates for MSWord and LaTeX are available at https://ieeedeis.org/publications/transactions-on-dielectrics-and-electrical-insulation/.

For this special issue suggested topics within the field of dielectric spectroscopy include, but are not limited to:

  • Charge related phenomena in dielectrics (charge injection, transport & trapping)
  • Thermally stimulated current & dielectric relaxation
  • Nanoscale measurements of electrostatic phenomena
  • Ferroelectric, piezoelectric & pyroelectric phenomena
  • Ferroelectrets & photoelectrets
  • Electrostatic & dielectric phenomena in life science: bioelectrets
  • Non-linear electrical & optical effects
  • Applications of thin-film ferroelectric materials
  • Electrets in organic electronics
  • Soft actuators & sensors
  • Functional materials and dielectrics

In accordance with IEEE policy, papers that have been published in any conference proceedings cannot be republished. A plagiarism tool will be used to verify originality. Submissions will undergo full peer review by at least two reviewers. Accepted papers will be available online within 10 days as Early view papers in IEEE Xplore.

The deadline for the submission of the manuscripts is November 30, 2023. Further questions concerning this Special Issue could be directed to either one of the three Guest Editors or directly to the Editor-in-Chief of the IEEE Transaction on Dielectrics and Electrical Insulation, Professor Michael Wübbenhorst ([email protected]). The Guest Editors for this special issue are:

Martin Kaltenbrunner Soft Matter Physics Johannes Kepler University Linz, Austria [email protected]  Dmitry Rychkov Deggendorf Institute of Technology, Weißenburg, Germany [email protected]  Reinhard Schwödiauer Soft Matter Physics Johannes Kepler University Linz, Austria [email protected]