Abstracts can now be submitted for IEEE CEIDP 2022 at https://www.conftool.pro/ceidp2022/. For more information about IEEE CEIDP 2022 and important dates, please refer to the conference website at https://ceidp.org/ Note: The abstract […]
There is an upcoming technical talk on the benefits of ester technology. This event has concluded; a summary of the presentation can be found below.
21st IEEE International Conference on Dielectric Liquids – ICDL2022 May 29 – June 2, 2022 Submission Deadline: September 30 October 15 October 31, 2021 http://www.icdl2022.org ICDL is the most important international […]
The Electrical Insulation Magazine is looking for two new Board members If you are excited to work together in a team of experts and help shape the content of the […]
2022 THOMAS W DAKIN DISTINGUISHED TECHNICAL CONTRIBUTIONS AWARD DEADLINE: JANUARY 31, 2022 Every two years, the IEEE Dielectrics and Electrical Insulation Society selects an individual for their outstanding, original contributions […]
STEVEN A BOGGS YOUNG PROFESSIONAL ACHIEVEMENT AWARD DEADLINE: JANUARY 31, 2022 In 2018, the IEEE Dielectrics and Electrical Insulation Society created the Steven A. Boggs Young Professional Achievement Award to be […]
ICD is mainly research-oriented conference with a broader scope in recognition of the fact that many breakthroughs in science occur at the interface between different areas and that the solid, […]
The IEEE Dielectrics and Electrical Insulation Society election of Members-at-Large to the Administrative Committee is now open. We hope you will take the time to exercise your vote and help […]
Graduate Student Fellowship award applications including a research proposal are invited from graduate students in the general areas of electrical insulation and dielectric phenomena. The graduate fellowships, established by the […]
International Electrical Insulation Conference (INSUCON) is a technically sponsored DEIS conference held in Europe at intervals of 3 or 4 years. INSUCON covers a wide range of materials, processes, and […]