Call for Papers China and Dielectrics and Electrical Insulation
CALL FOR PAPERS
Special Issue to Recognize and Celebrate the 60th Anniversary of Electrical Insulation and Dielectrics in China
We are pleased to announce that the June 2014 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be dedicated to recognize and celebrate the 60th Anniversary of Electrical Insulation and Dielectric Research and Development in China.
In 1953, aiming at the interdisciplinary research and education in the fields of electrical power engineering, materials, physics and chemistry, the division of Electrical Insulation and Electric Cables was founded in Jiaotong University at Shanghai. It was moved to Xi’an along with the Jiaotong University in 1956. In the past 60 years, the growth of this division was helped by many researchers in advanced countries. Now it has grown up to be the largest research group in the world.
This special issue is dedicated to show the wide range and broad spectrum of research in the field of dielectrics and electrical insulation in China. Authors wishing to have their papers considered for publication in this issue should submit their manuscripts to the Editor-in-Chief at the IEEE Transactions on Dielectrics and Electrical Insulation website (http://www.cloznet.com/ieeetdei). Moreover, in order to show the close collaborations with and the assistance from foreign researchers in the past 60 years, manuscripts of joint work with co-author(s) in China are welcome very welcome.
In accordance with IEEE policy, papers that have been published in any Conference proceedings cannot be republished. Therefore, authors of papers presented at conferences are strongly advised to significantly expand and enhance their conference papers version prior to submission to this Special Issue of the IEEE TDEI.
The deadline for the submission of the manuscripts is 31 August 2013. Papers submitted after this date will be considered but may not meet the printing deadline and, if accepted, will be included in subsequent regular issues.
The Papers must be formatted in accordance with the template that may be obtained from (http://www.cloznet.com/ieeetdei/TDEI%20Template.doc). The template is also provided at the website. Submissions should be marked during the submission process as special issue contributions by choosing the guest editor for this issue in the submission form.
The Guest Editor for this issue is:
Professor Shengtao Li (Xi’an Jiaotong University, State Key Lab Of Electrical Insulation and Power Equipment, No. 28 Xianning West Road, Xi’an 710049, China; Email: email@example.com; fax: +86 29 82668567)
Questions concerning this Special Issue could be directed to the Guest Editor or to the Editor-in-Chief of the IEEE Transaction on Dielectrics and Electrical Insulation Professor Reuben Hackam at: firstname.lastname@example.org.