2023 IEEE CEIDP-Call For Abstracts
Welcome to the 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (2023 IEEE CEIDP), which will be held at the Hilton Meadowlands Hotel in East Rutherford, NJ, USA. The conference features the centennial celebration of the CEIDP. The conference is planned to be in-person, from Sunday to Thursday, October 15-19, 2023.
The CEIDP was established within the Division of Engineering and Industrial Research, National Academy of Sciences – National Research Council in 1920 in nearby Manhattan, NY, and continues to provide opportunity for specialists from around the world to meet and exchange their expertise, annually, now under sponsorship of the IEEE Dielectrics and Electrical Insulation Society. More information about the CEIDP can be found at https://ceidp.org
Abstract submission deadline extended: February 10, 2023
Abstract acceptance notification: April 1, 2023
Full-paper submission deadline: June 1, 2023
Full-paper acceptance notification: July 15, 2023
Abstract submission is open for the 2023 IEEE CEIDP at https://www.conftool.pro/ceidp2023/