January 2014 EIC News
Plans for the 32nd Electrical Insulation Conference to be held in Philadelphia, PA between the 8th and 11th of June 2014 (see sites.ieee.org/eic) are already at an advanced stage. As…
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Call for Papers HVDC Insulation and Diagnostics
CALL FOR PAPERS High Voltage Direct Current (HVDC) Insulation and Diagnostics We are pleased to announce that the October 2014 issue of the IEEE Transactions on Dielectrics and Electrical Insulation…
DEIS ADCOM Member at Large elections
AdCom manages the affairs of the IEEE Dielectrics and Electrical Insulation Society (DEIS). It is made up of 18 members-at-large, plus ex-officio members. Each year 6 members-at-large are elected to…
Call for Papers China and Dielectrics and Electrical Insulation
CALL FOR PAPERS Special Issue to Recognize and Celebrate the 60th Anniversary of Electrical Insulation and Dielectrics in China We are pleased to announce that the June 2014 issue…
TDEI Call for Papers
CALL FOR PAPERS Nano dielectrics It is now almost exactly 10 years since the first experimental results on the unique dielectric properties of polymer nanocompositives were published. Since that…
TDEI Associate Editors Appointed
Results of the recent AdCom voting for the appointment of three new Associate Editors for the TDEI: Waldemar Ziomek Jacobus P. Holtzhausen Francesco Guastavino I can confirm that each of…
CEIDP Call for Papers
Dear colleagues, The Organizing Committee of the 2013 IEEE CEIDP (Conference on Electrical Insulation and Dielectric Phenomena) is pleased to inform you that the abstract submission site is now open….