Latest News from DEIS

2014 Dakin Award Winner

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2014 Thomas W Dakin Distinguished Technical Contributions Award Recipient: Prof. John Fothergill City University London, UK John will receive the Dakin Award at the 2014 EIC, Philadelphia, PA, June 8-11, 2014.

Calling High Voltage Labs!

Dielectrics and High Voltage Research Laboratories DEIS is collecting the names and weblinks of dielectrics and high voltage research laboratories, which will be posted on the DEIS website. If your laboratory should be included in this list,…

DEIS Joins IEEE Sister Society Group

DEIS joined a group of IEEE societies called Sister Societies, which includes the Industry Applications Society (IAS), Industrial Electronics Society (IES), Power Electronics Society (PELS), and the Power & Energy Society (PES). DEIS will…

January 2014 EIC News

Plans for the 32nd Electrical Insulation Conference to be held in Philadelphia, PA between the 8th and 11th of June 2014 (see are already at an advanced stage.  As the world’s premiere applied electrical insulation conference,…

Call for Papers HVDC Insulation and Diagnostics

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CALL FOR PAPERS  High Voltage Direct Current (HVDC) Insulation and Diagnostics  We are pleased to announce that the October 2014 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a special issue on High…

DEIS ADCOM Member at Large elections

AdCom manages the affairs of the IEEE Dielectrics and Electrical Insulation Society (DEIS). It is made up of 18 members-at-large, plus ex-officio members. Each year 6 members-at-large are elected to serve a 3-year term on the DEIS AdCom. The…

Call for Papers China and Dielectrics and Electrical Insulation

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CALL FOR PAPERS  Special Issue to Recognize and Celebrate the 60th Anniversary of Electrical Insulation and Dielectrics in China    We are pleased to announce that the June 2014 issue of the IEEE Transactions on Dielectrics and Electrical…

TDEI Call for Papers

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CALL FOR PAPERS Nano dielectrics   It is now almost exactly 10 years since the first experimental results on the unique dielectric properties of polymer nanocompositives were published. Since that time there has been a remarkable surge…

TDEI Associate Editors Appointed

Results of the recent AdCom voting for the appointment of three new Associate Editors for the TDEI: Waldemar Ziomek Jacobus P. Holtzhausen Francesco Guastavino I can confirm that each of the three nominated Associate Editors have been appointed…

CEIDP Call for Papers

Dear colleagues, The Organizing Committee of the 2013 IEEE CEIDP (Conference on Electrical Insulation and Dielectric Phenomena) is pleased to inform you that the abstract submission site is now open. The abstract submission deadline is February…