Transactions on Dielectrics and Electrical Insulation February 2016 TOC

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WANTED: Editor of the IEEE Dielectrics and Electrical Insulation Society Website (DEIS Web Editor)

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WANTED: Editor of the IEEE Dielectrics and Electrical Insulation Society Website (DEIS Web Editor) The IEEE Dielectrics and Electrical Insulation Society (DEIS) is seeking applicants for the position of the Editor of its Website. Applicants…

Transactions Table of Contents December 2015

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For access to the Transactions on Dielectrics and Electrical Insulation, go to http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=94 for the papers and past Transactions. [gview file="https://www.ieeedeis.org/wp-content/uploads/2016/01/TDEI-Dec-2015-TOC.pdf"]

Transactions Call for Papers on Materials for Electrical Energy Storage

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Transactions Call for Papers HVDC Polymetric Cables

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TDEI Reviewer Thank You and Listing

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TDEI Call for Papers Vacuum Insulation

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CALL FOR PAPERS Special Issue of the IEEE Transactions on Dielectrics and Electrical Insulation on Vacuum Insulation, Fundamentals and Applications Submission Deadline–30 November 2016 Publication Date December 2017  We are pleased to announce…

Transactions Special Issue on Partial Discharge Call for Papers

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Call for papers Special Issue on Partial Discharges Detection, Measurement and Interpretation    A Special lssue of the IEEE Transactions on Dielectrics and Electrical Insulation is being planned on Partial Discharges (PD) Detection, Measurement…

TDEI Letter to Reviewers

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Dear Reviewer, On behalf of the Editorial Board of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) and the IEEE Dielectrics and Electrical Insulation Society (DEIS) I would like to thank you for reviewing papers submitted…

Call for Papers: Condition Monitoring and Diagnostics of Electrical Insulation

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CALL FOR PAPERS Special Issue of the IEEE Transactions on Dielectrics and Electrical Insulation on Condition Monitoring and Diagnostics of Electrical Insulation   We are pleased to announce that the June 2016 issue of the IEEE Transactions…