CALL FOR PAPERS

 Special Issue of the

 IEEE Transactions on Dielectrics and Electrical Insulation

on

Condition Monitoring and Diagnostics

 

We are pleased to announce that the June 2016 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a special issue on Condition Monitoring and Diagnostics topics.

The following non-exclusive list of topics may serve as a guideline for prospective authors:

  • Condition monitoring and diagnostics of electrical power equipment
  • Diagnostics and monitoring of electrical insulation
  • Challenges in partial discharge electrical insulation based assessment
  • Impact of new materials on electrical insulation diagnostics
  • Emerging diagnostics methods
  • High frequency methods in diagnostics of electrical insulation
  • Application of signal and image processing to diagnostics of electrical insulation
  • Asset management in diagnostics of electrical insulating systems

 

In addition, special interest is to be focused on topics related to DC Diagnostics, i.e. methods for monitoring HVDC grids, cables, transformers, converters, breakers, substations, lines, insulators, etc.

In accordance with IEEE policy, papers that have been published in any conference proceedings cannot be republished. Therefore, authors of the International Conference on Conditioning Monitoring and Diagnosis are strongly advised to significantly expand and enhance their conference paper versions prior to submission to this Special Issue of the IEEE TDEI. All submitted papers will automatically be checked using CrossCheck software for plagiarism including self-plagiarism.

Authors are invited to submit their papers to the Guest Editors of the Special at the TDEI website (http://www.cloznet.com/ieeetdei) no later than 31 July 2015.

Please make sure to follow very closely the template which could be found on the Submission page of TDEI or directly from http://www.cloznet.com/ieeetdei/TDEI%20Template.doc.

All papers will undergo a standard peer-review process typical for all IEEE Transactions. Submissions should be marked during the submission process as special issue contributions by selecting the “Guest Editor” link and choosing the guest editors for this issue.

Questions concerning this Special Issue may be directed to the Guest Editors or to the Editor-in-Chief of the IEEE Transactions on Dielectrics and Electrical Insulation, Professor Reuben Hackam at hackam@uwindsor.ca.

The Guest Editors for this issue are:

Marek Florkowski     
ABB Corporate Research,
31-038 Kraków, Poland

Tel: +48 2222 38404,
marek.florkowski@pl.abb.com

Stanislaw Gubanski   
Chalmers University of Technology,
Department of Materials and Manufacturing Technology
Hörsalsv 11, 412 96 Gothenburg, Sweden

Tel: +46 31 772 1616,
stanislaw.gubanski@chalmers.se