Latest News from DEIS

Free IEEE TEC Registration

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Free registration to IEEE Transportation Electrification Community (IEEE TEC) for DEIS Members Starting on January 1st, 2022, DEIS has joined the IEEE Transportation Electrification Community (IEEE TEC) as a core member, see the website: https://tec.ieee.org/  This…

Call for Abstracts – CEIDP 2022

Abstracts can now be submitted for IEEE CEIDP 2022 at https://www.conftool.pro/ceidp2022/. For more information about IEEE CEIDP 2022 and important dates, please refer to the conference website at https://ceidp.org/  Note: The abstract…

DEIS Technical Talk – 28 Oct 2021

There is an upcoming technical talk on the benefits of ester technology. This event has concluded; a summary of the presentation can be found below. Rapp_Ester-Benefits_2021_Final_v1Download

Call for Abstracts – ICDL 2022

21st IEEE International Conference on Dielectric Liquids - ICDL2022 May 29 - June 2, 2022 Submission Deadline: September 30 October 15 October 31, 2021 http://www.icdl2022.org ICDL is the most important international conference…

Call for Applications: Electrical Insulation Magazine Board Members

The Electrical Insulation Magazine is looking for two new Board members If you are excited to work together in a team of experts and help shape the content of the IEEE Electrical Insulation Magazine (EIM), you may want to apply for a position…

2022 Dakin Award Call for Nominations

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2022 THOMAS W DAKIN DISTINGUISHED TECHNICAL CONTRIBUTIONS AWARD DEADLINE: JANUARY 31, 2022 Every two years, the IEEE Dielectrics and Electrical Insulation Society selects an individual for their outstanding, original contributions…