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Dielectrics and Electrical Insulation Society

Dielectrics and Electrical Insulation Society

an IEEE Society

  • About
    • Mission and Vision
    • President’s welcome
    • Administrative Committee (AdCom)
    • Join DEIS
    • Logo and brand identity
    • DEIS History
  • Technical Activities
    • Aging Factors Technical Committee
    • Diagnostics Technical Committee
    • Discharges in Gas at UHV Technical Committee
    • Functional Dielectrics
    • HVDC Cable Systems Technical Committee
    • Liquid Dielectrics Technical Committee
    • Nanodielectrics Technical Committee
    • Numerical methods applied to dielectrics
    • Outdoor Insulation Technical Committee
    • Smart Grids Technical Committee
    • Standards
    • All posts
  • Education
    • Educational Video
    • IEEE DEIS Summer School
    • Graduate Fellowships
    • Distinguished Lecturer Program
    • DEIS Resource Center
    • All posts
  • Conferences
    • Fully sponsored conferences
    • Co-sponsored conferences
    • Technically sponsored conferences
    • Information for Authors
    • All conferences
  • Publications
    • Transactions on Dielectrics and Electrical Insulation
    • Electrical Insulation Magazine
    • DEIS Standards
    • Author guidelines
    • Reviewer guidelines
    • Magazine Issues
  • Membership
    • Join DEIS
    • Chapters
    • IEEE Young Professionals
    • Women in Engineering
    • IEEE DEIS Fellows
    • Sister Societies
    • All posts
  • Awards
    • Society Awards
    • Graduate Fellowships
    • Conference Awards
    • All posts
  • All news
  • Join DEIS

Latest News from DEIS

News

2020-04-27

Editor-in-Chief of the Electrical Insulation Magazine (EIM)

The DEIS is seeking applicants for the position of Editor-in-Chief […]

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2020-04-26

Editor-in-Chief of the Transactions on Dielectrics and Electrical Insulation (TDEI)

The DEIS is seeking applicants for the position of Editor-in-Chief […]

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2020-03-25

April 2020 TDEI Issue

Every other month, The Transactions on Dielectrics and Electrical Insulation publishes four categories […]

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2020-01-26

February 2020 TDEI Issue

Every other month, The Transactions on Dielectrics and Electrical Insulation publishes four categories […]

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2020-01-13

2019 DEIS Graduate Fellowship Winners

Every year, the IEEE Dielectrics and Electrical Insulation Society offers […]

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2019-12-31

Call for Papers – Special TDEI Issue on Condition Monitoring and Diagnostics

CALL FOR PAPERS Special Issue of the IEEE Transactions on […]

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2019-12-10

December 2019 TDEI Issue

Every other month, The Transactions on Dielectrics and Electrical Insulation publishes four categories […]

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2019-11-18

Nominations for the Eric O. Forster Memorial Lecture

Nominations Eric O. Forster Memorial Lecture Nominations are invited for […]

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2019-10-20

Report on the 16th International Symposium on Electrets (ISE 16)

September 4–7, 2017, Leuven, Belgium The 16th International Symposium on […]

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2019-10-20

Report on ICDL 2019

The 20th IEEE International Conference on Dielectric Liquids (ICDL 2019), […]

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Posts pagination

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Latest posts

Education News Reports

Fabian Bill – 2023 DEIS Graduate Student Fellow

Simone Suraci
2026-06-23 0
Awards Education

2025 DEIS GRADUATE FELLOWSHIP WINNERS

Simone Suraci
2026-06-18 0
Education Highlights Hot Topics

2nd Asia Summer School on Dielectric Insulation

Simone Suraci
2026-06-05 0
Awards Education

2026 DEIS Graduate Fellowship Call

Simone Suraci
2026-05-28 0

Upcoming Events

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The Dielectrics and Electrical Insulation Society (DEIS) is involved in the study and application of dielectrics from the molecular level, through nano-structured materials, to insulation systems in industrial, commercial, and power system equipment, to emerging applications such as those at high power levels and in biological and other small-scale systems

Recent Posts

  • Fabian Bill – 2023 DEIS Graduate Student Fellow
  • 2025 DEIS GRADUATE FELLOWSHIP WINNERS
  • 2nd Asia Summer School on Dielectric Insulation
  • 2026 DEIS Graduate Fellowship Call
  • Call for nomination – IEEE DEIS AdCom

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